Fabrication of 50.0 μm Ultra-Fine Pure Rhodium Wire, Using a Multi-Pass Wire Drawing Process, for Probe Card Pins

Influence of an Inclusion on Multi-Pass Copper Shaped-Wire Drawing by 2D Finite Element Analysis

The size and length effects of an inclusion on multi-pass copper shaped-wire drawing were investigated. For this purpose, an experimental investigation on optimal die half-angle was conducted. Based on experimental data of optimal die half-angle, wire and inclusion deformations, drawing and hydrostatic stress of copper shaped-wires that contain an inclusion were calculated by two-dimensional fi...

Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages

In 1998, Carsem introduced the MLP (Micro Leadless Package). Today, the MLP has become the semiconductor industry’s package of choice for many devices with low-tomedium I/O count. Coincidentally, the MLP came out at the same time that smartphones were just starting to take off. Following the tremendous increase in market demand for smartphones, tablets and other handheld devices, the MLP soon o...

Developing Very Fine Nanopearlitic Structure in a High Carbon Steel Wire before Drawing

The effects of steel wire patenting process parameters on very fine interlamellar spacing in the pearlitic steel wire were investigated and the optimized condition of the process was achieved. In this work, the initial nanopearlitic structure was obtained in a 0.72 wt% carbon steel wire before the wire drawing process. The results were the minimum interlamellar spacing of 35 nm and maximum ulti...

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

In this article, the new challenges and requirements in wire bonding are discussed, the problems in ultra-fine-pitch wire bonding and insulated wire bonding are analyzed, and then two capillary solutions to the problems are presented. Actual bonding experiments using the new capillaries were carried out and the results were satisfactory. Compared to the standard design, a new capillary design h...

Palladium - coated and Bare Copper Wire Study for Ultra - Fine Pitch Wire Bonding